Micro silver articles and balanced ratio of all parts makes this silver compound ideal for heat transfer. The structure of the compound and also the injection package guarantee easy application. The content is sufficient for application on about 10 CPUs or chipsets.
Color | Silver-gray |
---|---|
Viscosity | 73 CPS |
Thermal Conductivity | >1.134 W/m-K |
Thermal Impedance | <0.201°C-in2/W |
Dielectric Constant | A >5.1 |
Operation Temperature | -50 ~300°C |
Weight | 0.5 g |