eNVigrease One

eNVigrease One

Micro silver articles and balanced ratio of all parts makes this silver compound ideal for heat transfer. The structure of the compound and also the injection package guarantee easy application. The content is sufficient for application on about 10 CPUs or chipsets.

Tech specification

Viscosity73 CPS
Thermal Conductivity>1.134 W/m-K
Thermal Impedance<0.201°C-in2/W
Dielectric ConstantA >5.1
Operation Temperature-50 ~300°C
Weight0.5 g